MEMS Forum

 

Date: Thursday, 9 May 2013
Time: 9:15 - 15:20
Venue: TECH West Stage


 

Presented by    


 

Sponsored by       

 

 

Outline:

MEMS devices have been proliferated across a broad range of applications including medical, wireless (including cellular and network technologies), biotechnology, computer, automotive and aerospace industries.   In spite of rapid advances in the field of MEMS, there are major issues impeding its commercial success.  One key challenge that has daunted companies is the transition from prototype to volume manufacturing – most companies have limited access to design and process expertise, as well as manufacturing. 

This Forum invites leading players in the MEMS industry to share their strategies to bridge the gap from R&D to manufacturing and a business model that minimizes risk and cost for companies who want to move beyond proof-of-concept to volume production, paving the way for prototype-stage devices to make a successful transition to volume manufacturing.

 

Session Chairs:

- Morning Session:  Dr. Janak Singh, Senior Manager, Institute of Microelectronics
- Afternoon Session: Dr. Tang Min, Industry Development Manager, Institute of Microelectronics, A*STAR

 

Agenda: 

Morning Session

09:15 – 09:25


Welcome Remarks

09:25 – 09:50

 

MEMS Market/Industry Trends

Mr Pascal Viaud, Chief Technology Officer, Yole Développement, Taiwan


09:50 – 10:15

 

Consumer MEMS – A Technology Play

Mr. Leopold Beer, Regional President Asia-Pacific, Bosch Sensortec GmbH


10:15 – 10:40

 

Embracing the boom days of MEMS

Dr. Alex Gu, Director of Technical Marketing-Miniaturised Medical Devices, A*STAR Institute of Microelectronics

 

10:40 – 10:50

Break Time & Networking

 

10:50 – 11:15

 

Large Volume MEMS Manufacturing

Mr Rakesh Kumar, Sr. Director (MEMS)

GLOBALFOUNDRIES


11:15 – 11:40

 

Smart Systems enable Internet of Things

Mr. Giuseppe Noviello, Marketing Director, High-End Sensor & Analog Division, ANALOG, MEMS & Sensor Group, STMicroelectronics


11:40 – 12:05

 

MEMS Packaging: Foundry Perspective & Prospective

Mr. Ranjan Rajoo, Principal Engineer, GLOBALFOUNDRIES

 

12:05 – 13:05

 

 Lunch Time & Networking 

Afternoon Session

13:05 – 13:30

 

MEMS Packaging

Dr Sunil Wickramanayaka, Director, Interconnects and Advanced Packaging - Special Projects, A*STAR Institute of Microelectronics


 

13:30 – 13:55


Low Temperature (sub-200°C) PECVD dielectrics for MEMS

Mr David Butler, Vice President, Marketing, SPTS Technologies
13:55 – 14:20

 

State-Of-Teh-Art Wet Spray Technology:

Etching-Cleaning-Photo Resit Stripping

Mr Igor Eichinger, Head of Process Engineering, Siconnex

 

14:20 – 14:45

 

Development of Micromirror to achieve HD display for lowest cost and lowest power consumption

Mr Fred Ishii, Founder, Iron City Micro Display, Inc.


 

14:45 – 15:10 


MEMS Environment Sensors

Dr Michael Bolt, Director, NXP Semiconductors

 

15:10 – 15:20


Closing Remarks

* Programs and timing are subject to change without prior notice.

 

 

 Chairs' Introduction:

 

Dr. Janak Singh, Senior Manager, Institute of Microelectronics

 

Dr. Janak Singh currently holds the position of Senior Manager, MEMS Industry Development at Institute of Microelectronics (IME), Singapore.  His interests include marketing and business development for IME’s MEMS portfolio, which include full suite of MEMS R&D services starting from concept, design, fabrication, ASIC, package and characterizations. He got his Ph.D. from Indian Institute of Technology in 1998 & MBA from NUS Business School in 2008. His research interests includes optical MEMS, bio MEMS and other physical MEMS such as inertial and MEMS for medical applications. He has close to 60 scietific publications and 7 patents. <Top>

 


Dr. Tang Min, Industry Development Manager, Institute of Microelectronics, A*STAR

 

Dr. TANG Min is currently serving as Senior Manager, Industry Development at Institute of Microelectronics (IME), A*STAR, Singapore, where she markets IME’s MEMS portfolio and manages the business development with customers from US, Europe, Japan, China and Taiwan.

 

She received her BEng in polymer material science and engineering and MSc degree in microelectronics & solid-state electronics from Shanghai Jiao Tong University in 1998 and 2001, respectively, and a PhD degree in microelectronics & MEMS technology from Nanyang Technological University, in 2007. She has authored ~40 technical papers in peer reviewed journals and proceedings and holds 5 patents, concerning magnetic MEMS, RF MEMS, CMOS BEOL / MEMS process integration and packaging. 

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Speakers' Introduction:
  

Mr. Leopold Beer, Regional President Asia-Pacific, Bosch Sensortec GmbH

 

Leopold Beer joined Bosch Sensortec shortly after its foundation in 2006 and has been working as a sales director and afterwards global marketing director. Since March 2013 he is the Regional President of Asia Pacific.

Prior to joining Bosch Sensortec, Leopold Beer held various engineering and managerial positions in the semiconductor and the automotive industry. <Top>

 

Dr. Alex Gu, Director of Technical Marketing-Miniaturised Medical Devices, A*STAR Institute of Microelectronics


Dr. Alex Gu is the Director of Technical Marketing, Miniaturised Medical Devices (MMD), at the A*STAR Institute of Microelectronics (IME). He spent 10 years in the Honeywell Sensors and Wireless Lab as a principal research scientist before joining A*STAR Institute of Microelectronics. His industrial research covers broad areas include chemical and biosensors, ultrasound, chip-level thermal management, chip-level vacuum systems, and deeply miniaturized medical equipments.

 

Alex was the Principal Investigator and/or Program Manager for various externally funded research programs totaling >$15M during his 10-year tenure with Honeywell. He has authored over 20 research publications and holds more than 20 patents. He received his Ph.D. in Pharmaceutics and M.E.E in Electrical Engineering, both from the University of Minnesota, Twin Cities, USA in 2003.

 

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Giuseppe Noviello, Marketing Director, High-End Sensor & Analog Division, ANALOG, MEMS & Sensor Group, STMicroelectronics

Giuseppe Noviello is the Marketing Director for Human to Machine Interface products in the High-End Sensor & Analog Division that is part of Analog, MEMS & Sensor Group of STMicroelectronics since December 2009.

In 1994 Giuseppe Noviello joined STMicroelectronics in Catania Italy working on new analog products definition and application. In 2004 he was appointed Technical Marketing Manager of the Advanced Analog and Logic BU with HQ in Singapore to work in the roadmap definition of new analog products for various application fields.

In 2009, Giuseppe Noviello joined AMS Group and he became Marketing Director for Sensor and MicroActuators products with main focus on touch screen controllers. In this position, he participated to the development of a MEMS magnetic switch with IME for mobile and consumer application.

Giuseppe Noviello filed more than 8 patents in the human to machine interaction and related sensors applications.

Giuseppe Noviello was born in Bari Italy in 1966. He holds the M.S. degree in electronic engineering, major optoelectronics, from the Technology University of Bari. <Top>

 

Mr. Ranjan Rajoo, Principle Engineer, OSAT Supply Chain Management/Turnkey Engineering, GLOBALFOUNDRIES

Ranjan is currently a Principal Engineer , OSAT supply chain management / turnkey engineering with Globalfoundries. Prior to joining he have been working with A-star Institute of Microelectronics (IME) for 15 years in Microsystem, Design  & Simulation task. His area of research was 2.5D, 3DIC using TSVs, ultra thin chip embedding  and wafer level packaging. His expertise are characterisation of mechanical & moisture properties of electronics packaging materials. He has set up new & novel experimental techniques to characterise electronics packaging materials, assembly process interaction & accelerated reliability, drop, impact and vibration testing.

He has authored and co-authored more than 60 papers in journal and international conferences. He received 2 outstanding papers  in prestigious conferences. He has given invited talks in the area of lead free solder/ Halogen Free printed circuits boards. Currently, he holds 6 U.S patents and 2 patents have been commercialised. He is also a member of IEEE, CPMT and IMAPS societies. <Top>

 

Dr. Sunil Wickramanayaka, Director, Interconnects and Advanced Packaging - Special Projects

A*STAR Institute of Microelectronics

 

Dr. Sunil Wickramanayaka is the Director of Interconnects and Advanced Packaging (IPP) – Special Projects, at the A*STAR Institute of Microelectronics. He has 22 years of experience in the semiconductor industry. His extensive experience includes the design and manufacturing of FEOL and BEOL semiconductor equipment, particularly for dry etching, CVD and wafer bonding applications, as well as the development of semiconductor and MEMS packaging technologies, including 3D / 2.5D integration with Through-Silicon Vias (TSV). 

Sunil has authored over 100 research publications and holds more than 40 patents. He received his Ph.D. in Optoelectronics Engineering from Shizuoka University, Japan in 1992 and an MBA from the University of Southern Queensland, Australia in 2006.

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Mr. David BUTLER, Vice President, Marketing, SPTS Technologies

 

David Butler currently serves as the Vice President Marketing at SPTS Technologies.  With 22 years of experience in the semiconductor capital equipment and related industries, he first joined Electrotech in 1988 as a Senior Process Engineer, and subsequently moved into a product marketing role, managing PVD products.  In 2004, he assumed the position of Director of Marketing for the PVD/Etch/CVD products at Trikon Technologies. Following the merger of Trikon and Aviza in 2006, he was appointed Vice President of Marketing for Aviza Technology.


In 2009, Mr. Butler was promoted to Vice President of product and corporate marketing with the formation of SPTS. In this position, he currently oversees all global marketing activities for SPTS’ full range of PVD, Etch, CVD and thermal products.


Mr. Butler graduated from Loughborough University with a B.S. in Physics.  He has published numerous technical articles and delivered multiple presentations on wafer processing technologies worldwide.   <Top>

 

Mr. Igor Eichinger, Head of Process Engineering, Siconnex

 

From 1995 to 2006 Igor Eichinger was working in the automotive branch. He switched to Siconnex in january 2007.  At Siconnex he is the Head of the Process Engineering Department. In the laboratory. he is responsible for developing and testing wet chemical processes such as etching, stripping and cleaning. <Top>

 

Mr. Fred Ishii, Founder, Iron City Micro Display, Inc.

 

After graduating from Tokyo Institute of Technology with a BS in Physics, Mr. Fred Ishii joined Sony Corporation in 1970 and remained with them for 34 years through the era of Sony's developing and dominating the Television Industry. He started as a factory engineer and worked for display R&D in his early career. During the 1980's and 1990's, Mr. Ishii was assigned to start-up and develop Sony’s American factories. At the peak of his career at Sony, he was responsible for the vertical integration of high-margin components such as the Shadow Mask and CRT Glass by way of organic development and joint ventures. The success lead to Sony’s TV share in U.S. to the top position. After 30 years of factory start-up and technology development for Sony Corporation, Mr. Ishii joined and led Sony Venture Capital in Silicon Valley. His dual track mind of science and engineering was quickly absorbed by the spirit of Silicon Valley, the world's center of innovation and entrepreneurship. Since retiring Sony Corporation, he has turned his endeavors to continue researching display devices at his own desk. The resulting patents are the genesis of his company. Mr. Ishii continued to maintain his relationship with Sony as a contracted technology advisor and a friend to the firm. <Top>

 

Dr Michael Bolt, Director, NXP Semiconductors

 

Director of the NXP Research Asia Lab. Michael has more than 25 years of experience in all aspects of semiconductor research and development, plus also in production. Michael has specialized in CMOS, BiCMOS, LDMOS process integration and process development. Michael has worked for NXP Semiconductors and Philips in various process R&D roles in the Netherlands, France, Switzerland and Singapore. <Top>

 

  
Presentation Abstract:
 

MEMS – A Technology Play 

Mr Leopold Beer, Regional President Asia-Pacific, Bosch Sensortec GmbH


MEMS, tiny micro-electro-mechanical systems that function as miniature machines, are showing up in all facets of our daily lives — in our smartphones, tablets, cameras, laptops, video games! Your favorite consumer product likely contains more than a half-dozen MEMS. From accelerometers and gyroscopes that ‘interpret’ motion into the digital realm, to magnetic compasses, pressure sensors and MEMS microphones, MEMS sensors have dramatically improved the user experience with electronic devices.

The presentation will address the current status of MEMS sensor integration in mobile devices by highlighting the most frequent use cases and subsequent sensor requirements.

Further the evolution of MEMS sensor integration in mobile devices will be projected based on overall system optimization aspects.

Some of the addressed aspects:

· Current MEMS accelerometer context in smartphones – product adaptation industry learning curve
· Evolution of use cases – introduction of new sensor types, from technology push to market pull
· Which are the prerequisites for being successful in this market
· How to align a relative complex product/technology development process with fast changing market requirements

MEMS sensors will be omnipresent in the future, spreading from mobile phones to other portable devices, but this evolution will not be a smooth carry-over. Adapting to specific device and use case requirements will be the key to spark this market.

Bosch Sensortec is a fully owned subsidiary of Robert Bosch GmbH focusing specifically on consumer electronics applications for MEMS sensors. The product portfolio includes triaxial geomagnetic and acceleration sensors, triaxial gyroscopes, barometric pressure sensors, multi sensor packages and a comprehensive software portfolio for various applications. While Bosch is leading the MEMS sensor market globally, Bosch Sensortec achieved a leading position in consumer electronic market within a very short period of time. Technology leadership and customer focus are the main ingredients for this outstanding success story.   <Top>

 

Embracing the boom days of MEMS

 

Dr. Alex Gu, Director of Technical Marketing - Miniaturised Medical Devices 

A*STAR Institute of Microelectronics


The unique characteristics, including small size, light weight, CMOS compatibility, and mass parallel processing, make MEMS the ideal technology platform responding to the emerging trends of modern society.  These characteristics enable deep miniaturisation, ultra low power, multiplexing, and chip-level integration.   Being a critical player in MEMS R&D and an incubator of future MEMS technologies, IME has established strategic platform capabilities in all segments of the MEMS R&D, from the building blocks such as CMOS-compatible SOI and AlN process modules and TSV; to devices/sensors such as accelerometers, RF MEMS resonators, and CMUT; to functional modules/subsystems such as Si photonics and energy harvesters; to system level integration such as IMU and TPMS.  These capabilities, in conjunction with the world-class in-house ASIC design team, enable IME to quickly integrate a variety of sensors into functional microsystems to address specific industrial needs. 

 

In this talk, some of the MEMS-based sensors and microsystems developed in IME for such applications in distributed sensors network, TPMS, and biomedical will be showcased. <Top>

 

Smart Systems enable Internet of Things

Francesco Italia, General Manager, High-End Sensor & Analog Division, STMicroelectronics

Filling the universe with Sensors everywhere is the dream of all the sensor manufacturers. And the Sensorized Universe, when it exists, will enable a marvelous utopia where indoor lights and heating are adjusted as people enter or leave a room, street lighting adjusts to ambient conditions, services—or awareness of available services—are delivered to you as you need them, traffic moves at an optimized pace, and medical wellness technologies put us on a path to a healthier and longer life. That utopia is being made possible with the development of Integrated Smart Systems, stemming from a combination of Sensors, microcontrollers for sensor data processing and low power wireless transmission.

The Internet of Things (IoT) has emerged as a seed for a new era that requires new sensor and connectivity technologies. The integrated smart sensor systems, which will be part of the IoT concept and include hardware and software solutions, will deliver the processing and analysis capabilities to extract raw data from multiple sensors in the world and make decisions to determine, deliver and control the ingredients of an active, healthy and efficient daily life style. <Top>

 

MEMS Packaging

Dr. Sunil Wickramanayaka, Director, Interconnects and Advanced Packaging-Special Projects, A*STAR Institute of Microelectronics

 

MEMS packaging has evolved from traditional ceramic packaging to wafer level packaging.  However, there is no standardized packaging flow as MEMS packaging is more device-specific. This issue is further compounded by the development of advanced MEMS. Wafer level packaging, in which the entire package is formed while MEMS devices are in wafer format, is rapidly growing but to-date, only wafer capping has been commercialized. Wafer level encapsulation and wafer-level chip-scale packaging are other rapidly evolving branches of MEMS packaging. The latter, in particular, is able to support the integration of MEMS and ASIC with the use of TSV.

Wafer level or chip scale bonding is a critical step in MEMS packaging. MEMS device typically needs to be able to move freely in a vacuum or inert gas environment. This is achieved by bonding the MEMS device with a second substrate. The method of required bonding depends on the application of MEMS.  Most of the MEMS require hermitic bonding to prevent moisture contamination while some other MEMS need high-vacuum bonding.

As a result of extensive R&D over the last decade, IME has developed advanced packaging technologies supported by innovative bonding techniques. Some of these capabilities will be addressed during the presentation. 


  <Top>

  

State-Of-The-Art Wet Spray Technology - Etching – Cleaning – Photo Resist Stripping

Mr Igor Eichinger, Head of Process Engineering, Siconnex


Siconnex is a manufacturer of tools for wet chemical processing of semiconductor wafers with their headquarter in Austria and offices in the US, France, Malaysia, Singapore and Taiwan.

Our tools are working on batch spray technology.

Typical applications are for example:

-    Metal etching
-    Oxide etching
-    Photoresist stripping
-    Cleaning

In Order to replace wet benches in fabs around the world Siconnex has developed a highly efficient solution with 90% less DI-water and exhaust consumption.

Equipped with an Endpoint Detection System excellent process repeatability can be guaranteed. 5 automated process steps can be performed consecutively in an enclosed and operator-safe process environment on a footprint of only 1,6m². <Top>

 

Development of Micromirror to achieve HD display for lowest cost and lowest power consumption.

Mr Fred Ishii, Founder, Iron City Micro Display, Inc.

 

A new micromirror device was developed to minimize (1) form factor, (2) manufacturing cost, and (3) power consumption. The efficiency was achieved by developing (1) vertical cantilever based micromirror hinge, and (2) high speed data transfer (HSVT) methodology to transfer data in loss-less fasion. Micromirror with vertical hinge enables the fabrication of micromirrors with two mechanical components: hinge and mirror, the theoretical minimum. HSVT enables 90% reduction in power consumption of digital display backplane while reducing the number of connecting pads by 80%.   <Top>

 

MEMS Sensors 

Dr Michael Bolt, Director, NXP Semiconductors  

 

NXP research team has been working on the development of environmental sensor technologies, in and on a standard CMOS process. By integrating these sensors on to a CMOS platform we can then design smart, low power and low cost sensors.

The CMOS sensor platform allows; 
Cost effective integration option for
  - Multiple sensors
  - Design IP, such as converters, processors, communication, peripherals


Sensor fusion to improve accuracy, robustness and reliability


Ultra Low Power consumption

NXP has just released an exciting environmental CMOS-based sensor product, called SEN300, that has the following characteristics;
Combines 11 environmental sensors on one IC
   - 1 ultra-accurate Temperature sensor (±0.1C)
   - 4 Relative Humidity sensors (±2% RH)
   - 6 Ambient light sensors (Visible, UV and near-IR)
        > Can also provide incident light directional information


 Sensors are integrated with other design IP. For example,
   - Standard SPI (with interrupt pin)
   - User-writeable 2Kbit NV memory
   - On-chip 10-bit  ADC


Ultra-low-power (0.1mW)

Can be combined with a small energy harvestor for unlimited operation time  <Top>