SESSIONS/EVENTS

SEMICON Singapore 2012 Call for Speakers

Manufacturing Efficiency:

 Automation

 Cost of Ownership

 Overall Equipment Effectiveness

 Supply Chain Management

 Process Optimization

 Productivity factor

 AMHS Management

 Efficiency Feed Forward Control System

 Integration (SPC) In Line Alert Systems

 Excursion Control Cycle Time management

 Improvement Mechanisms Predictive

 Preventative Maintenance Management

Advanced Packaging:

 Wafer Level Packaging

 3D Integration

 Through-Silicon-Via

 Through-Glass-Via

 Flip Chip Packaging

Packaging Interconnection Technologies:

 Cu wire Bonding Technology

 Wire Bonding Technology

 Flip Chip Technology

 Solder Alternatives

 TSV

3D IC Materials & Processes:

 Materials and Processes for Traditional and Advanced Microelectronic systems, 3D Packages, 3D ICs

 Materials market

MEMS:

 MEMS Market

 Systems and Sensor Network

 Materials and Process technologies

 Emerging MEMS Devices and Sensors

 Packaging, Testing and Reliability

 Applications of MEMS Devices and Sensors

 Power MEMS - Energy Reduction, Energy Scavenging and Energy Source Finding

Chemical Mechanical Polishing:

 Consumables

 Slurry

 Disk

 Pad

 Cost of consumables

The submission is close. Thank you for your interest. 

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