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SEMI Technology Symposium (STS)

S3—Test Technologies

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STS—S3
Tuesday, 6 May 2008
09:30
13:15
Level 3, Suntec Singapore

Session Chair:
Mr S. Y. Lee
Senior Manager, PLM-Test
Stats ChipPAC Ltd

[09:30–10:30]
Keynote: Trends, Market Drivers and Outlook – IC Assembly and Test, 2008 and Beyond

Mr Michael W. Schraeder
Vice President Test Products and Services
Stats ChipPAC Inc.

   

[10:30–11:00]
Semiconductor Failure Analysis for 60 Years and Beyond

Mr Xue Ming
Senior Manager, Failure Analysis Lab
Infineon Technologies

   

[11:00–11:30]
Parallel RF Testing for Multi-band Transceiver

Mr Tan Eng Keong
Senior Consultant, Centre of Expertise
Verigy Limited

   
 

[11:30–11:45]
Break

   

[11:45–12:15]
Efuse Methodology and Characterization

Mr Alan Lek
Manager for the Product Engineering Department
Chartered Semiconductor Manufacturing Ltd

   

[12:15–12:45]
RF SoC Testing

Ms Jaime Liang
Applications Engineer
LTX Asia International Inc.

   

[12:45–13:15]
Probe Designs for Fine Pitch Applications – Kelvin and Wafer-Level Test

Mr Jim Brandes
Product Manager
Everett Charles Technologies

   
   
   

Programmes are subject to change without prior notice.

Seats are available on first-come-first-served basis

Co-sponsored by: