SEMI Technology Symposium (STS)

S2—Advanced Packaging Technologies (Day 2 of 2)

Event Code: Date: Time: Location:

STS—S2 Wednesday,7 May 2008 09:30–12:40 Level 3, Suntec Singapore

Session Chair: Mr Nelson Wong VP – Ball Bonder Business Unit Kulicke & Soffa

	[09:30–10:30] Keynote: Main drivers of New Packaging Technology Trends Mr Mario Bolanos Director, Semiconductor Packaging Technology Research Texas Instruments
	[10:30–11:00] 3D Packaging and the Future of TSV Technology Ms Jan Vardaman President TechSearch Inc
	[11:00–11:10] Break
	[11:10–11:40] 3D Integration with TSV Technology Dr Yoon Seung Wook Deputy Lab Director Institute of Microelectronics
	[11:40–12:10] Wire Bonding Challenges for Sensitive Metallization Mr Jaime Castaneda Product Manager Small Precision Tools/ SPT Asia Pte Ltd
	[12:10–12:40] 3D System-in-Package (SIP) Technology Overview Dr Hsueh-An Yang Department Manager (R&D) Advanced Semiconductor Engineering Inc. (Taiwan)

Programmes are subject to change without prior notice.

Seats are available on first-come-first-served basis.