PRESS
Apr 26, 2012
3D-IC Opens a New Era of IC Packaging and Testing
Apr 24, 2012
Apr 24, 2012
Growing the Yong Talent Pool for Semiconductor Industry SEMI Signs MOU with Republic Polytechnic
Apr 23, 2012
SEMICON Singapore 2012 to Kick Off on April 24
Apr 23, 2012
Southeast Asia Fab Capacity to Grow 11% in 2012
Apr 12, 2012
LED Enlightens a Brighter Future for Environmental Protection and Energy Savings
Mar 22, 2012
North American Semiconductor Equipment Industry Posts February 2012 Book-to-Bill Ratio of 1.01
Mar 21, 2012
3D IC Opens a New Era of IC Packaging and Testing
Mar 12, 2012
SEMI Reports 2011 Global Semiconductor Equipment Sales of $43.53 Billion
Mar 8, 2012
SEMI and SSIA Launch the Electronics Young Talent Outreach Program
Mar 6, 2012
Southeast Asia Fab Capacity to Grow 10% in 2012
Mar 6, 2012
Equipment Spending Growth Flat in 2012; Record Fab Equipment Spending Expected for 2013
Feb 21, 2012
Feb 7, 2012
Silicon Wafer Revenues Up in 2011
Jan. 13, 2012
Fab Spending Down in 2012— Dip in First Half, but by Mid-Year Recovery Begins
Dec. 19, 2011
Semiconductor Packaging Materials Market to Reach $25.7 Billion by 2015
May. 11, 2011
Mar. 29, 2011
Mar. 18, 2011
North American Semiconductor Equipment Industry Posts February 2011 Book-to-Bill Ratio of 0.87
Mar. 8, 2011
SEMI Reports 2010 Global Semiconductor Equipment Sales of $39.5 Billion
Mar. 7, 2011
Fab Spending in SEA Expected a Strong Growth of 36% YoY
Feb. 23, 2011
North American Semiconductor Equipment Industry Posts January 2011 Book-to-Bill Ratio of 0.85
Feb. 22, 2011
Strong Expansion of High-end Capacity Boosting Singapore’s Clout as a Semiconductor Hub in Asia
Jan. 27, 2011
Rodney Morgan Appointed as Chair and David Wilhoit & Gan Wah Teng as Vice Chair to SEMI Singapore Regional Adversary Board
