PAVILIONS

Brace for the Era of 3D ICs

Exhibit Now to Stay Ahead of the Game!

Accelerated integration of functionalities in consumer electronics will take place through heterogeneous integration and 3D IC will be the critical technology. According to ASE, commercialization of 2.5D & 3D ICs will likely take place by 2013. Yole Développment also indicated the shipment of 3D IC wafer will approach 10 million units in by 2012 and the strong market demand will drive innovations in packaging & testing filed.

- A 6-stacked 3D IC Chip developed through the IME-led 3D IC TSV Consortium
- A demo to show the ‘live’ performance of a 2D chip and a 3D Chipand be able to compare the difference – contributed by Tezzaron
- IME’s 300mm 3D IC research capabilities and an overview of 3D IC technology
- And content from ASE, Tezzaron, Xilinx, etc…