PAVILIONS

SEMICON Singapore 2012 - 3D IC Gallery

Brace for the Era of 3D ICs

Exhibit Now to Stay Ahead of the Game!

Accelerated integration of functionalities in consumer electronics will take place through heterogeneous integration and 3D IC will be the critical technology. According to ASE, commercialization of 2.5D & 3D ICs will likely take place by 2013. Yole Développment also indicated the shipment of 3D IC wafer will approach 10 million units in by 2012 and the strong market demand will drive innovations in packaging & testing filed.

 SEMICON Singapore 2012 3D IC Pavilion Salessheet Download 

Be part of the game and stay ahead. Book your space NOW!!

Features of 3D IC Pavilion

 3D IC Gallery

 Innovative Technology Center (Technology presentation)

 3D IC Forum

 Exclusive Promotion for 3D IC Pavilion

 Connect with Global and Local 3D IC Business

Benefits of Exhibiting at 3D IC Pavilion

 Identification with critical emerging and adjacent market topics and technologies

 Inclusion in pre-show and at-show Pavilions traffic-building promotions

 Connect with audience of highly qualified technologists and key decision-makers from companies on the cutting-edge of electronics manufacturing

 High visibility onsite at SEMICON Singapore

Who Should Exhibit

 3D IC Equipment & Materials Suppliers

 3D IC Design

 3D IC Foundry

 3D IC Packaging

 3D IC Testing Systems/Metrology

 3D IC Research Institutes and Universities

Questions?

Exhibit Sales Information